GBOND-TDIM-MIB

MIB Reference — IPNetwork Monitor · Updated October 05, 2026

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Organization: IETF ADSL MIB Working Group

Last Updated: 2007-04-29

Category: DSL and Broadband, Standard: IETF

Description: IETF MIB for TDM-based G.Bond inverse multiplexing over DSL, managing bonded channel configuration.

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What Is GBOND-TDIM-MIB?

This is an IETF/ITU-T standards-based MIB module for managing multi-pair bonded xDSL interfaces using Time-Division Inverse Multiplexing (TDIM), as defined in ITU-T Recommendation G.998.3 (G.Bond/TDIM). It exposes configuration and status data for bonded DSL channel groups, covering how individual xDSL lines are aggregated into a single higher-bandwidth logical link. Its monitoring value centers on the health and synchronization status of bonded links, detecting individual bonded-pair failures, differential delay between pairs, and overall bonding group operational state, which functions as the link-layer health data for this technology rather than general device hardware sensors. It explicitly must be used in conjunction with the common GBOND-MIB module, which provides shared objects across all G.Bond bonding technologies. It is typically deployed on DSLAM or bonded-DSL customer premises equipment implementing multi-pair inverse multiplexing for higher-bandwidth broadband access. Engineers implementing or auditing this functionality typically reference the GBOND-TDIM-MIB RFC/standard documentation for the authoritative specification.

IPNetwork Monitor allows you to monitor SNMP objects defined in GBOND-TDIM-MIB. Use the built-in SNMP Monitoring Browser to explore available variables, view their current values and descriptions, and select the objects you want to monitor. You can then create SNMP monitors, configure thresholds, and receive alerts when monitored values change.

Supported Devices

  • vendor-neutral, standards-based MIB, not tied to a specific manufacturer
  • DSLAM and bonded xDSL customer premises equipment

Monitoring Examples

An administrator monitoring a bonded DSL group would poll per-pair status objects to detect if one physical pair in the bond has dropped out of sync while others remain up. Differential delay figures between bonded pairs would reveal cabling or provisioning issues causing degraded throughput on the aggregate link. Because this MIB depends on GBOND-MIB for shared bonding-group identifiers, cross-referencing the two would confirm which bonding scheme is in use on a given troubled circuit.

What Can Be Monitored

  • bonded DSL pair status
  • bonding group configuration
  • inter-pair differential delay
  • aggregate link synchronization state
  • per-pair fault detection
Imported Objects

From GBOND-MIB

gBondMIBMODULE-IDENTITY

From IF-MIB

InterfaceIndex
ifIndexOBJECT-TYPE

From SNMPv2-CONF

MODULE-COMPLIANCE
NOTIFICATION-GROUP
OBJECT-GROUP

From SNMPv2-SMI

Counter32
MODULE-IDENTITY
NOTIFICATION-TYPE
OBJECT-TYPE
Unsigned32

From SNMPv2-TC

TEXTUAL-CONVENTION
TruthValue
OIDs

RFC description

G.Bond/TDIM multi-pair xDSL bonding using time-division inverse multiplexing interface management.

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Download GBOND-TDIM-MIB