Description: The objects in this MIB module are used to manage the multi-pair bonded xDSL Interfaces using time-division inverse multiplexing (TDIM), defined in ITU-T recommendation G.998.3 (G.Bond/TDIM).

This MIB module MUST be used in conjunction with GBOND-MIB module, common to all G.Bond technologies.

The following references are used throughout this MIB module:

[G.998.3] refers to: ITU-T Recommendation G.998.1: 'Multi-pair bonding using time-division inverse multiplexing', January 2005.

[WT-159] refers to: DSL Forum Technical Report: 'Management Framework for xDSL Bonding', January 2007.

Naming Conventions: BCE - Bonding Channel Entity CO - Central Office CPE - Customer Premises Equipment GBS - Generic Bonding Sublayer SNR - Signal to Noise Ratio

Copyright (C) The Internet Society (2007). This version of this MIB module is part of RFC XXXX; see the RFC itself for full legal notices.