7 modules in Technology: SLA/OAM
| Module | Description |
|---|---|
| DL-SLA-MIB | Service Level Agreement MIB for DL devices providing objects to configure, measure, and report on SLA metrics. |
| ENTERASYS-IP-SLA-MIB | Enterasys Networks MIB for configuring IP SLA probe entries and retrieving round-trip-time and jitter measurement results. |
| ENTERASYS-SERVICE-LEVEL-REPORTING-MIB | Enterasys Networks MIB for storing and reporting IP service level metrics measurement results. |
| F3-CFM-MIB | ADVA Optical Networking F3 platform MIB for IEEE 802.1ag Connectivity Fault Management OAM operations on FSP 150 devices. |
| HH3C-TWAMP-MIB | HH3C MIB for Two-Way Active Measurement Protocol (TWAMP) configuration and test results on H3C devices. |
| HUAWEI-MPLSOAM-MIB | Huawei MPLS OAM (Operations, Administration, and Maintenance) MIB for LSP connectivity verification and fault detection. |
| HUAWEI-TWAMP-MIB | Huawei TWAMP (Two-Way Active Measurement Protocol) MIB for managing TWAMP test sessions and round-trip delay measurements. |