HUAWEI-COMMTEST-MIB :: hwLoopLineTestMeltVerEntry

MIB Reference — IPNetwork Monitor · Updated September 14, 2026

All MIBsHUAWEI-COMMTEST-MIBhwLoopLineTestMeltVerEntry

hwLoopLineTestMeltVerEntry

Module: HUAWEI-COMMTEST-MIB

OID (symbolic): HUAWEI-COMMTEST-MIB::hwLoopLineTestMeltVerEntry

OID (numeric): 1.3.6.1.4.1.2011.6.21.1.1.1.8.1

Node type: OBJECT-TYPE

Access: not-accessible

Description: This table provides the information about the MELT chip on the board, including the vendor, hardware version, and software version. The indexes of this entry are hwFrameIndex and hwSlotIndex.

OID Breakdown

Upper-level ancestors (9 from the standard OID tree / other modules)
Numeric OIDNameModule
1isoLANART-AGENT
1.3orgAirPair-MIB
1.3.6dodAirPair-MIB
1.3.6.1internetAirPair-MIB
1.3.6.1.4privateAirPair-MIB
1.3.6.1.4.1enterprisesAirPair-MIB
1.3.6.1.4.1.2011huaweiHUAWEI-3COM-OID-MIB
1.3.6.1.4.1.2011.6huaweiUtilityHUAWEI-3COM-OID-MIB
1.3.6.1.4.1.2011.6.21hwTestHUAWEI-BTEST-MIB
Numeric OIDNameModule
1.3.6.1.4.1.2011.6.21.1hwTestCommonHUAWEI-COMMTEST-MIB
1.3.6.1.4.1.2011.6.21.1.1hwTestCommonMibHUAWEI-COMMTEST-MIB
1.3.6.1.4.1.2011.6.21.1.1.1hwTestCommonMIBObjectsHUAWEI-COMMTEST-MIB
1.3.6.1.4.1.2011.6.21.1.1.1.8hwLoopLineTestMeltVerTableHUAWEI-COMMTEST-MIB
1.3.6.1.4.1.2011.6.21.1.1.1.8.1hwLoopLineTestMeltVerEntryHUAWEI-COMMTEST-MIB