All MIBs › HUAWEI-DIE-MIB › hwDeviceSensorGroup
hwDeviceSensorGroup
Module: HUAWEI-DIE-MIB
OID (symbolic): HUAWEI-DIE-MIB::hwDeviceSensorGroup
OID (numeric): 1.3.6.1.4.1.2011.5.25.317.3.2.3
Node type: OBJECT-GROUP
Description: The DIE sensor configuration.
OID Breakdown
Upper-level ancestors (9 from the standard OID tree / other modules)
| Numeric OID | Name | Module |
|---|---|---|
| 1 | iso | LANART-AGENT |
| 1.3 | org | AirPair-MIB |
| 1.3.6 | dod | AirPair-MIB |
| 1.3.6.1 | internet | AirPair-MIB |
| 1.3.6.1.4 | private | AirPair-MIB |
| 1.3.6.1.4.1 | enterprises | AirPair-MIB |
| 1.3.6.1.4.1.2011 | huawei | EXPERTV2-MIB |
| 1.3.6.1.4.1.2011.5 | huaweiMgmt | HUAWEI-3COM-OID-MIB |
| 1.3.6.1.4.1.2011.5.25 | huaweiDatacomm | HUAWEI-3COM-OID-MIB |
| Numeric OID | Name | Module |
|---|---|---|
| 1.3.6.1.4.1.2011.5.25.317 | hwDIEmib | HUAWEI-DIE-MIB |
| 1.3.6.1.4.1.2011.5.25.317.3 | hwDIEConformance | HUAWEI-DIE-MIB |
| 1.3.6.1.4.1.2011.5.25.317.3.2 | hwDIEObjectGroups | HUAWEI-DIE-MIB |
| 1.3.6.1.4.1.2011.5.25.317.3.2.3 | hwDeviceSensorGroup | HUAWEI-DIE-MIB |